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| DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC3223TB 5 V, SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC3223TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. FEATURES * Wideband response : fu = 3.2 GHz TYP. @ 3 dB bandwidth * Medium output power : PO (sat) = +12.0 dBm @ f = 1.0 GHz : PO (sat) = +9.0 dBm @ f = 2.2 GHz * High linearity * Power gain * Supply voltage * Port impedance : PO (1 dB) = +6.5 dBm @ f = 1.0 GHz : PO (1 dB) = +5.0 dBm @ f = 2.2 GHz : GP = 23.0 dB TYP. @ f = 1.0 GHz : GP = 23.0 dB TYP. @ f = 2.2 GHz : VCC = 4.5 to 5.5 V : input/output 50 APPLICATION * IF amplifiers in DBS converters etc. ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C3J Supplying Form * Embossed tape 8 mm wide * 1, 2, 3 pins face the perforation side of tape * Qty 3 kpcs/reel PC3223TB-E3 Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC3223TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PU10491EJ01V0DS (1st edition) Date Published May 2004 CP(K) Printed in Japan NEC Compound Semiconductor Devices 2004 PC3223TB PIN CONNECTIONS Pin No. Pin Name INPUT GND GND OUTPUT GND VCC (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 1 2 3 4 5 6 2 1 PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM OUTPUT AMPLIFIER (TA = +25C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 ) fu (GHz) 2.9 2.3 1.0 2.7 3.2 PO(sat) (dBm) +10.0 +11.5 +13.5 +8.5 +12.0 GP (dB) 15 23 33 23 23 NF (dB) 6.5 5.0 3.5 6.0 4.5 ICC (mA) 26 25 22 25 19 Part No. C3J 3 Package 6-pin super minimold Marking C1D C1E C1F C2L C3J PC2708TB PC2709TB PC2710TB PC2776TB PC3223TB Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10491EJ01V0DS PC3223TB PIN EXPLANATIONS PIN No. 1 Pin Name INPUT Applied Voltage (V) - Pin Voltage Note (V) 0.96 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuits is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 4 OUTPUT Voltage as same as VCC through external inductor 6 VCC 4.5 to 5.5 - Power suplly pin. Witch biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. 2 3 5 GND 0 - Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. - Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. Function and Applications Note Pin Voltage is measured at VCC = 5.0 V Data Sheet PU10491EJ01V0DS 3 PC3223TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Total Circuit Current Power Dissipation Operating Ambient Temperature Storage Temperature Input Power Symbol VCC ICC PD TA Tstg Pin TA = +25C Conditions TA = +25C, Pin 4 and 6 TA = +25C TA = +85C Note Ratings 6.0 40 270 -40 to +85 -55 to +150 +10 Unit V mA mW C C dBm Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Supply Voltage Symbol VCC Conditions The same voltage should be applied to pin 4 and 6. Operating Ambient Temperature TA -40 +25 +85 C MIN. 4.5 TYP. 5.0 MAX. 5.5 Unit V ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Circuit Current Power Gain Symbol ICC GP Test Conditions No input signal f = 1.0 GHz, Pin = -30 dBm f = 2.2 GHz, Pin = -30 dBm Saturated Output Power PO (sat) f = 1.0 GHz, Pin = -5 dBm f = 2.2 GHz, Pin = -5 dBm Gain 1 dB Compression Output Power Noise Figure NF PO (1 dB) f = 1.0 GHz f = 2.2 GHz f = 1.0 GHz f = 2.2 GHz Upper Limit Operating Frequency Isolation fu ISL 3 dB down below flat gain at f = 0.1 GHz f = 1.0 GHz, Pin = -30 dBm f = 2.2 GHz, Pin = -30 dBm Input Return Loss RLin f = 1.0 GHz, Pin = -30 dBm f = 2.2 GHz, Pin = -30 dBm Output Return Loss RLout f = 1.0 GHz, Pin = -30 dBm f = 2.2 GHz, Pin = -30 dBm Gain Flatness MIN. 15.0 20.5 20.0 +9.0 +6.0 +4.5 +3.0 - - 2.8 28.0 28.0 9.0 12.0 9.0 9.0 - TYP. 19.0 23.0 23.0 +12.0 +9.0 +6.5 +5.0 4.5 4.0 3.2 33.0 33.0 12.0 17.5 12.0 12.0 0.9 MAX. 24.0 25.5 26.0 - - - - 6.0 5.5 - - - - - - - - dB dB dB GHz dB dB dBm dBm Unit mA dB GP f = 0.1 to 2.2 GHz 4 Data Sheet PU10491EJ01V0DS PC3223TB OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Output Intercept Point Symbol OIP3 Test Conditions f = 1.0 GHz f = 2.2 GHz Reference Value +17.8 +14.8 Unit dBm Data Sheet PU10491EJ01V0DS 5 PC3223TB TEST CIRCUIT VCC C4 1 000 pF 1 000 pF C3 L 6 50 IN C1 100 pF 1 4 C2 100 pF 50 OUT 100 nH 2, 3, 5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type C1, C2 C3 C4 L Chip Capacitor Chip Capacitor Feed-through Capacitor Chip Inductor Value 100 pF 1 000 pF 1 000 pF 100 nH INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). 6 Data Sheet PU10491EJ01V0DS PC3223TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD IN C1 C3 L C2 OUT C4 COMPONENT LIST Value C1, C2 C3, C4 L 100 pF 1 000 pF 100 nH Notes 1. 2. 3. 4. 30 x 30 x 0.4 mm double sided copper clad polyimide board. Back side: GND pattern Solder plated on pattern : Through holes Data Sheet PU10491EJ01V0DS 7 PC3223TB TYPICAL CHARACTERISTICS (TA = +25C , unless otherwise specified) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 21 20 TA = +85C Circuit Current ICC (mA) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 30 25 Circuit Current ICC (mA) No input signal No input signal VCC = 5.0 V 20 15 10 5 0 TA = +25C 19 18 17 16 15 - 60 - 40 - 20 TA = - 40C 0 1 2 3 4 5 6 0 +20 +40 +60 +80 +100 Supply Voltage VCC (V) Operating Ambient Temperature TA (C) POWER GAIN vs. FREQUENCY 25 TA = +25C Input Return Loss RLin (dB) INPUT RETURN LOSS vs. FREQUENCY 10 TA = +25C 23 Power Gain GP (dB) 0 VCC = 4.5 V - 10 - 20 - 30 - 40 0.1 VCC = 5.5 V 21 VCC = 5.0 V 19 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V VCC = 5.0 to 5.5 V 1.1 2.1 3.1 4.1 5.1 17 15 0.1 1.1 2.1 3.1 4.1 5.1 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY 0 - 10 Isolation ISL (dB) OUTPUT RETURN LOSS vs. FREQUENCY 10 Output Return Loss RLout (dB) TA = +25C TA = +25C 0 - 10 - 20 VCC = 5.0 V - 30 - 40 0.1 VCC = 5.5 V VCC = 4.5 V - 20 - 30 - 40 - 50 0.1 VCC = 4.5 to 5.5 V 1.1 2.1 3.1 4.1 5.1 1.1 2.1 3.1 4.1 5.1 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10491EJ01V0DS PC3223TB POWER GAIN vs. FREQUENCY 25 VCC = 5.0 V 23 Power Gain GP (dB) Input Return Loss RLin (dB) INPUT RETURN LOSS vs. FREQUENCY 10 VCC = 5.0 V 0 - 10 - 20 TA = - 40C - 30 - 40 0.1 TA = +25C TA = +85C TA = - 40C 21 19 TA = +85C 17 TA = +25C 15 0.1 1.1 2.1 3.1 4.1 5.1 1.1 2.1 3.1 4.1 5.1 Frequency f (GHz) Frequency f (GHz) ISOLATION vs. FREQUENCY 0 - 10 Isolation ISL (dB) OUTPUT RETURN LOSS vs. FREQUENCY 10 VCC = 5.0 V VCC = 5.0 V Output Return Loss RLout (dB) 0 - 10 - 20 - 30 - 40 0.1 - 20 - 30 - 40 - 50 0.1 TA = - 40 to +85C TA = - 40 to +85C 1.1 2.1 3.1 4.1 5.1 1.1 2.1 3.1 4.1 5.1 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PU10491EJ01V0DS 9 PC3223TB OUTPUT POWER vs. INPUT POWER 15 10 Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER 15 10 Output Power Pout (dBm) f = 1.0 GHz TA = +25C VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V f = 1.0 GHz VCC = 5.0 V 5 0 -5 - 10 - 15 5 0 -5 - 10 - 15 - 20 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 5 10 TA = - 40 to +85C - 20 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 5 10 OUTPUT POWER vs. INPUT POWER 15 10 Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER 15 f = 2.2 GHz 10 VCC = 5.0 V Output Power Pout (dBm) f = 2.2 GHz TA = +25C 5 VCC = 5.5 V 0 -5 - 10 - 15 - 20 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 5 10 VCC = 4.5 V VCC = 5.0 V 5 0 -5 - 10 - 15 - 25 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 5 10 TA = - 40 to +85C Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) 20 Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) OUTPUT POWER (2 tones), IM3 vs. INPUT POWER f1 = 1 000 MHz 10 f2 = 1 001 MHz 0 - 10 - 20 - 30 - 40 - 50 - 60 VCC = 4.5 V VCC = 5.0 V IM3 Pout VCC = 5.5 V 5.0 V 4.5 V OUTPUT POWER (2 tones), IM3 vs. INPUT POWER 20 f1 = 2 200 MHz 10 f2 = 2 201 MHz 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 5 10 VCC = 4.5 to 5.5 V IM3 Pout VCC = 5.5 V 5.0 V 4.5 V VCC = 5.5 V - 70 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 5 10 Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10491EJ01V0DS PC3223TB S-PARAMETERS (TA = +25C, VCC = Vout = 5.0 V) S11-FREQUENCY 1.0 GHz 2.2 GHz S22-FREQUENCY 1.0 GHz 2.2 GHz Data Sheet PU10491EJ01V0DS 11 PC3223TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 1.250.1 2.00.2 1.3 0.65 0.65 0.1 MIN. 0.90.1 0.7 12 Data Sheet PU10491EJ01V0DS 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 PC3223TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be each attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10491EJ01V0DS 13 PC3223TB * The information in this document is current as of May, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 14 Data Sheet PU10491EJ01V0DS PC3223TB For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) 5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0401 |
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